SemiAnalysis:

Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more  —  IEDM 2025 Round-Up  —  It's an odd time in the chipmaking industry.  On one hand, we are ramping into the biggest supercycle ever seen.

SemiAnalysis:

Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more  —  IEDM 2025 Round-Up  —  It's an odd time in the chipmaking industry.  On one hand, we are ramping into the biggest supercycle ever seen.

Source: TechMeme
Source Link: http://www.techmeme.com/260114/p17#a260114p17