Marco Chiappetta / Forbes:

Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users  —  As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.

Marco Chiappetta / Forbes:

Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users  —  As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.

Source: TechMeme
Source Link: https://www.techmeme.com/260715/p51#a260715p51