Nikkei Asia:

SIA and BCG: by 2032, the US will have the capacity to manufacture 28% of chips below 10nm, while China is expected to make only 2% of the most advanced chips  —  U.S. set to triple its semiconductor manufacturing capacity due to CHIPS Act  —  LOS ANGELES — The U.S. is set to more than triple …

Nikkei Asia:

SIA and BCG: by 2032, the US will have the capacity to manufacture 28% of chips below 10nm, while China is expected to make only 2% of the most advanced chips  —  U.S. set to triple its semiconductor manufacturing capacity due to CHIPS Act  —  LOS ANGELES — The U.S. is set to more than triple …

Source: TechMeme
Source Link: http://www.techmeme.com/240509/p1#a240509p1